论文名称为“Isolation enhancement for W-band coplanar array antennas based on silicon micromachining technology”。该文通过具有三角栅格排布的四分之一波长扼流槽阵列实现了W频段收发共面天线子系统在小间距情况下的宽带隔离度提升。基于MEMS体硅微加工工艺，可以实现该去耦结构与收发天线的共面集成与一体化。工作主要完成人姚仕森、程钰间。

论文链接：https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9166695

Abstract—A W-band decoupling structure sandwiched between a pair of high-gain step-profiled horn array antennas using the silicon micromachining technology is proposed. To suppress the surface wave, 18 choke slots with a depth of one quarter wavelength at 94 GHz are arranged in a triangular-grid array and the isolation can be averagely improved by about 7 dB with a range of 2–20 dB. This decoupling structure and two W-band coplanar array antennas are fashioned and fully integrated together by the silicon micromachining technique. Five 400 µm thick and one 650 µm thick silicon wafers are utilized and the total thickness of the antennas is 2.65 mm. Thanks to this technology, light weight, compact size, and high integration of the decoupling structure and array antennas can also be achieved. Additionally, the two array antennas share a common ground plane within a small edge-to-edge spacing of 6.05 mm where TM surface waves exist. Experimental studies validate the performance of the proposed triangular-grid choke slot array.

Index Terms—Array antenna, full integration, isolation enhancement, silicon micromachining technology, triangular-grid, W-band.