论文名称“Three-dimensional interconnection with magnetically coupled transition for W-band integration applications”，提出了一种基于磁耦合过渡结构的W波段三维互连方式。与平面方法相比，即使在不同的电路板上，它也可以连接复杂封装中的不同组件或模块，并具有宽带和低损耗性能。为了克服辐射损耗，选择微加工的矩形微同轴线（RμCL）作为三维信号传输线，因为它具有轻量级的坚固结构和低串扰传输特点。选择基片集成波导（SIW）作为组件和模块周围的公共信号线。焊接过程会引入不可预测的寄生电抗，这可能会恶化传输性能。为了构建一个从TEM模式到TE10模式的非焊接场变换结构，通过垂直于电流场矢量的方向在SIW上蚀刻U形磁槽，并直接打开RμCL的尾部。同时，通过分析基于物理的等效电路模型来研究传输特性。研究了等效电路中的阻抗变换比等关键参数的提取方法，以简化综合方法。根据综合指南设计了一个背对背的互连原型。制作了原型并进行了测量，以验证该设计的正确性。测量结果表明，所提出的过渡在85 GHz至100 GHz的频段内具有大于13 dB的回波损耗和约1.5 dB的插入损耗，这使其在W波段具有高密度互连应用的潜力。工作主要完成人：孙建旭，程钰间，王磊，樊勇。

论文链接：https://ieeexplore.ieee.org/document/9770411

Abstract: In this article, a new class of 3-D interconnection with the magnetically coupled transition is proposed at W-band. In contrast to planar approaches, it can connect different components or modules in a complex package with wideband and low-loss performance, even if in separate circuit boards. To overcome the radiation loss, the micromachined rectangular microcoaxial line (RμCL) is chosen to be the 3-D signal line, owing to its low-weight robust structure and low-crosstalk transmission. The substrate integrated waveguide (SIW) is chosen to act as the common signal line around the components and modules. The soldering process will introduce the unpredictable parasitic reactance, which can deteriorate the transmission performance. To construct a nonsoldering field transformation structure from the TEM mode to the TE10 mode, the U-shaped magnetic slot is etched on the SIW through the direction orthogonal to the current field vector, and the tail of the RμCL is directly open. Meanwhile, the transmission characteristics is studied by analyzing the physics-based equivalent-circuit model of this interconnection. The extraction methods of the key parameters, such as turn ratios in the equivalent circuit, are studied for simplifying the synthesis approach. A back-to-back interconnection prototype is designed by the synthesis guideline. The prototypes are fabricated and measured to validate the correctness of this design. The measured results show that the proposed transition achieves a bandwidth from 85 to 100 GHz with the return loss better than 13 dB and the insertion loss around 1.5 dB, which make it promising for high-density interconnection applications at W-band.

Index Terms—Magnetically coupled transition, rectangular microcoaxial line (RμCL), substrate integrated waveguide (SIW), 3-D interconnection, W-band.