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新型高隔离技术宽带多路基片集成波导功分器

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First Author:宋开军(Kaijun Song)

Patent Applicant:宋开军(Kaijun Song)

Disigner of the Invention:宋开军(Kaijun Song)

Type of Patent:发明

State of Patent:Authorized patents

Service Invention or Not:no

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