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A hybrid 2D ADI-FDTD subgridding scheme for modeling on-chip interconnects,
Hits:Note:IEEE Trans. Advanced Packaging, vol.24, no.4, pp.528-533, Nov. 2001.
All the Authors:R. Mittra, W. Yu, Y. Wang,Bing-Zhong Wang
Translation or Not:no
Gender:Male
Education Level:With Certificate of Graduation for Doctorate Study
Degree:Doctor of Engineering
Status:On the job
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