Publications

· Wu Zhou, Huijun Yu, Jian Zeng, Bei Peng, Zhi Zeng, Xiaoping He, Yang Liu. Improving the dynamic performance of capacitive micro-accelerometer through electrical damping. Microsyst. Technol. 2015. [PDF] (5)

· He Jianbo, Xie Jin, He Xiaoping, Du Lianming, Zhou Wu, Zhiyuan Hu. Analytical and high accurate formula for electrostatic forceof comb-actuators with ground substrate. Microsyst. Technol. 2015 21(1):1–6. [PDF] (6)

· Wu Zhou, Huaqin Shen, Zaoyang Guo and Bei Peng. Modeling the pull-in behavior of electrostatically actuated microbeams by an approximate finite element method. Int. J. Numer. Model., 2014, 27: 89–98. [PDF] (4)

· Wu Zhou, Yu Chen, Bei Peng, Hui Yang, Huijun Yu, Heng Liu, Xiaoping He. Air damping analysis in comb micro accelerometer. Adv. Mech. Eng., 2014, 2014: 373172-6. [PDF] (5)

· Huijun Yu, Wu Zhou, Bei Peng, Xiaoping He, Xiaohong Hao and Zhi Zeng. Modeling the Boron-doping Silicon Beam by a Multilayer Model. Math. Probl. Eng., 2014: 894286-6, 2014.[PDF] (4)

· He Jianbo, Xie Jin, He Xiaoping, Du Lianming, Zhou Wu, Wang Libin. Calculating capacitance and analyzing nonlinearity of micro-accelerometers by Schwarz-Christoffel mapping. Microsyst. Technol., 2014 (20):1195–1203. [PDF] (4)

· Wu Zhou, Huijun Yu, Bei Peng, Huaqin Shen, Xiaoping He and Wei Su. Modeling the Microstructure Curvature of Boron-Doped Silicon in Bulk Micromachined Accelerometer. Materials, 2013, 6: 244-254.[PDF] (4)

· Peng Bei, Huang Chengcheng, Zhou Wu, Yu Huijun, Zeng Zhi. Improved Digital Image Correlation Method for Eliminating Pixel Shape-Induced Errors in Shear-Strain Calculations. J. Test. Eval., 2013, 41(2): 231-235.

· Wu Zhou, Baili Li, Bei Peng, Wei Su and Xiaoping He. Prediction of Gap Asymmetry in Differential Micro Accelerometers. Sensors, 2012, 12: 6857-6868. [PDF] (4)

· Bei Peng, Qiushu Zhang, Wu Zhou, Xiaohong Hao, Li Ding. Modified correlation criterion for digital image correlation considering the effect of lighting variations in deformation measurements. Opt. Eng., 2012, 51(1), 017004. [PDF] (4)

· Xiaoping He, Wei Su, Bei Peng, Wu Zhou. Electrostatic compensation method in frequency robustness design of micro accelerometer. J. Micro-Nanolithogr. MEMS MOEMS, 2012, 11(4): 043001-1- 043001-6. [PDF] (4)

· Zhou Wu, He Xiaoping, Su Wei, Zhang Fengtian, Li Bailin. Frequency Robustness Design of Electrostatic Stiffness Resonant Micro Accelerometer Based on Error Sensitivity. Journal of Mechanical Engineering, 2010, 46(10): 14-18. (In Chinese) [PDF] (8)

· Zhou Wu, He Xiaoping, Su Wei, Li Bailin, Chen Lili. Characteristics of stiffness coupling in force-balanced accelerometer. Transducer and Microsystem Technologies, 2010, 29(4): 35-37, 40. (In Chinese) [PDF] (8)

· Zhou Wu, He Xiaoping, Su Wei, Li Bailin, Chen Lili. Error sensitivity analysis of folded beam stiffness. Journal of Machine Design, 2010, 27(2): 80-83. (In Chinese) [PDF] (9)

· Zhou Wu, He Xiaoping, Su Wei, Li Bailin. Nonlinear Errors of Force-balanced Micro Accelerometer. China Mechanical Engineering, 2009, 20(15):1791-1793. (In Chinese) [PDF] (8)

Proceedings

· Wu Zhou, Wei Su, Xiao-ping He, Bailin Li and Lili Chen. Application of Parallel Capacitor for Force Transferring in Resonant Micro Accelerometer. Proceedings of the 2010 5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, January 20-23, Xiamen, China, 2010: 479-482. [PDF] (8)

· Zhou Wu, He Xiao-Ping, Su Wei, Li Bai-Lin1, Chen Li-Li. Effects of gap error on the capacitive micro accelerometer. DTIP of MEMS and MOEMS – Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, April 1- 3, Roman, 2009: 307-312.  [PDF] (8)

· Zhou Wu, Li Bailin, He Xiaoping, Su Wei, Zhang Fengtian. Calibration study of force-balanced micro accelerometer based on least squared method and genetic algorithm. 2009 IEEE International Conference on Mechatronics and Automation, August 9- 12, 2009: 1357-1361. [PDF] (11)

· Feng-tian ZHANG, Xiao-ping HE, Zhi-gui SHI, and Wu ZHOU. Design of silicon resonant micro accelerometer based on electrostatic rigidity. Lecture Notes in Electrical Engineering in International Conference in Electronic Engineering and Computing Technology, London, United kingdom, July 1-3, 2009: 37-45.