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J. X. Sun, Y. J. Cheng, L. Wang and Y. Fan, “Three-dimensional interconnection with magnetically coupled transition for W-band integration applications,” IEEE Trans. Microw. Theory Techn., vol. 71, no. 1, pp. 112-121, Jan. 2023.

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Pre One:H. Xie, Y. J. Cheng, W. Y. Li, L. Wang and Y. Fan, “A Ka-band watt-level high-efficiency doherty amplifier MMIC in 90-nm GaAs technology,” IEEE Microw. Wireless Compon. Lett., vol. 33, no. 2, pp. 204-207, Feb. 2023.

Next One:Wu, Ya Fei; Guo, Yongxin; Cheng, Yu Jian,“Self-progressive near-field focusing 2-D full frequency scanning slot array antenna based on ridge-gap waveguide,” IEEE Trans. Antennas Propag., vol. 71, no. 1, pp. 639-649, Jan. 2023.

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