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Paper Publications

D. Wang, H. B. Hu, Q. Peng, C. H. Xia, Y. H. Yin, N. Yang, X. L. Qi, Y. Fan, Y. Fan, and Y. J. Cheng, “A low-loss scalable fan-out wafer level packaging for W-band phased array transceiver,” IEEE Trans. Microw. Theory Techn., vol. 73, no. 9, pp. 5966-5978, Sep. 2025.

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Pre One:L. W. Mou, J. X. Sun, and Y. J. Cheng, “An efficient method for designing subarrayed phased arrays with all-azimuth wide beam-scanning range,” IEEE Trans. Antennas Propag., vol. 73, no. 9, pp. 6697-6706, Sep. 2025.

Next One:L. Wang, D. Wang and Y. J. Cheng, “A GaAs four-channel TRX beamformer with compact size based on stacked-chip process,” IEEE Microw. Wireless Techn. Lett., vol. 35, no. 9, pp. 1404-1407, Sep. 2025.

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