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电子线路与无源器件系统集成通信功能组件制造技术研究及产业, 广东省科技厅, 2015/09/01-2019/04/20, 已验收, 广东省应用型科技研发专项资金项目
多物理场调控电生长铜柱互连阵列及其在集成电路封装载板应用, 国家自然科学基金委, 2019/08/20, 进展顺利, 国家自然科学基金面上项目
基于多场耦合效应的多孔介质填铜协同机制研究, 国家自然科学基金委, 2015/01/01-2019/02/25, 已验收结题, 国家自然科学基金面上项目
高密度互连挠性印制电路板关键技术研发, 企业委托技术开发, 2018/06/06, 进展顺利, 企业横向委托技术开发项目
印制电路特种电子化学品创新团队, 广东省科技厅, 2013/07/30-2018/11/22, 已验收(优秀), 广东省引进第四批创新创业团队项目
A composite of epoxy resin/copper (II) acetylacetonae as catalyst of copper addition on insulated substrate.Journal of Materials Science: Materials in Electronics,.2018,2018: 1-6
Enhancing adhesion performance of no-flow prepreg to form multilayer structure of printed circuit boards with plasma-induced surface modification.Surface and Coatings Technology,.2018,2018, 333
Enhancing inductance of spiral copper inductor with BaFe12O19/poly (phenylene oxide) composite as an embedded magnetic core.Composites Part B: Engineering,.2018,2018, 138
A comparison of typical additives for copper electroplating based on theoretical computation.Computational Materials Science,.2018,2018, 147
Computational analysis and experimental evidence of two typical levelers for acid copper electroplating.Electrochimica Acta,.2018,2018, 273
Effects of microstrip line fabrication and design on high-speed signal integrity transmission of PCB manufacturing process.Circuit World,.2018,2018, 44