陶志华
Senior Engineer

Gender:Male

Education Level:With Certificate of Graduation for Doctorate Study

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电子电路电镀技术

Date:2019-08-24 Hits:

Publisher:科学出版社

Place of Publication:北京

Description of Publication:本书以电沉积金属基础知识与理论为基础,内容包括电镀前处理、电镀金属及合金、特种镀覆、电镀污染防治等,内容涵盖了电结晶理论、高速镀、化学镀、脉冲镀和复合镀等,重点针对电镀层均匀性问题、电子封装互连材料的非等向性电镀等,系统地介绍了靠前外常用及新前沿电镀填盲孔及填通孔制备原理、技术特点与工艺等,尽可能汇集具有一定优选性及实用性的电子电镀互连技术。本书适用于所有从事电子电镀、化学镀的生产,教学和科研人员阅读。

School Sign:电子科技大学

Type of Works:编著

Publication Design:

Classification of Disciplines:Engineering

First-Level Discipline:Chemical engineering and technology

ISBN No.:978-7-03-060971-7

Translated or Not:no

Number of Words:458000

Date of Publication:2019-06-30

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