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Paper Publications

Bing-Zhong Wang, Y. Wang, W. Yu, and R. Mittra, “A hybrid 2D ADI-FDTD subgridding scheme for modeling on-chip interconnects,” IEEE Trans. Advanced Packaging, vol.24, no.4, pp.528-533, Nov. 2001.

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Note:IEEE Trans. Advanced Packaging, vol.24, no.4, pp.528-533, Nov. 2001.

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Pre One:Bing-Zhong Wang, W. Shao, and Y. Wang, “2D FDTD method for exact attenuation constant extraction of lossy transmission lines,” IEEE Microwave and Wireless Components Letters, vol.14, no.6, pp.289-291, June 2004.

Next One:Bing-Zhong Wang, D. Zhao, and J. Hong, “Modeling stripline discontinuities by neural network with knowledge-based neurons,” IEEE Trans. Advanced Packaging, vol.23, no.4, pp.692-698, Nov. 2000.

王秉中

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