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备注:IEEE Trans. Advanced Packaging, vol.23, no.4, pp.692-698, Nov. 2000.
全部作者:J. Hong, D. Zhao,Bing-Zhong Wang
是否译文:否
上一条:Bing-Zhong Wang, Y. Wang, W. Yu, and R. Mittra, “A hybrid 2D ADI-FDTD subgridding scheme for modeling on-chip interconnects,” IEEE Trans. Advanced Packaging, vol.24, no.4, pp.528-533, Nov. 2001.
下一条:Bing-Zhong Wang, "Enhanced thin-slot formalism for the FDTD analysis of thin-slot penetration," IEEE Microwave and Guided Wave Letters, vol.5, no.5, pp.142-143, May 1995.