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Thermoelastic dissipation in etch-hole filled Lamé bulk-mode silicon microresonators

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Journal:IEEE Electron Device Letters

First Author:C. Tu

Indexed by:Article

Correspondence Author:J. Lee

Document Code:WOS: 000300580000050

Volume:33

Issue:3

ISSN No.:0741-3106

Translation or Not:no

Date of Publication:2012-03-01

Date of Publication:2012-03-01

Pre One:Increased dissipation from distributed etch holes in a lateral breathing mode silicon micromechanical resonator

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