王海
331
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联系方式:wanghai@uestc.edu.cn,详细英文主页请点击:English Homepage,点击此处查看我们的最新研究简介。
王海于2012年在美国加州大学河滨分校电子工程系(现电子与计算机工程系)获博士学位(电子与计算机工程专业)。
主要研究领域包括人工智能(AI)辅助芯片设计、芯片设计自动化(EDA),以及计算机设计与优化(Computer Design)。现致力于研究基于人工智能的芯片全自动设计与性能优化技术,特别是暗硅芯片与3D芯片的性能优化技术。主持完成了包括国家自然科学基金在内的多项国家级科研项目,与华为等公司进行产业化合作,获华为公司优秀合作项目奖,科研成果己成功商用并创造大量产值。
已在国际会议与期刊上发表论文60余篇:近年来以第一作者发表CCF A类与一区top期刊论文8篇(3篇计算机设计领域国际顶级期刊 IEEE Transactions on Computers (TC) 论文,3篇芯片设计自动化领域国际顶级期刊 IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD) 论文,1篇工业电子与信息领域国际顶级期刊 IEEE Transactions on Industrial Informatics (TII) 论文,1篇神经网络领域国际顶级期刊 IEEE Transactions on Neural Networks and Learning Systems (TNNLS) 论文),第一作者发表CCF B类与二区论文7篇(均发表于芯片设计自动化领域国际顶级期刊 ACM Transactions on Design Automation of Electronic Systems (TODAES) 或国际顶级会议 DATE、ICCAD),CCF C类论文若干,并获得芯片设计自动化重要国际会议 ASP-DAC 2019(CCF C类会议)最佳论文奖提名。现担任本领域国际顶级期刊 IEEE TCAD,IEEE TC,IEEE TPDS,ACM TODAES 评审,担任计算机设计领域国际顶级会议ICCD组委会委员,并多次担任芯片设计自动化国际顶级或重要会议( 包括 DATE、ASP-DAC、ISQED )的技术委员会委员。
近期代表论文(粗体表示本人或本人指导研究生,星号*表示本人指导的研究生):
1. H. Wang, X. Long*, and X.-X. Liu, "FastESN: Fast Echo State Network", IEEE Transactions on Neural Networks and Learning Systems (TNNLS), 2022. (中科院一区top期刊,影响因子10.4,CCF B类期刊) (下载)
2. H. Wang, W. He*, Q Yang*, X. Peng, and H. Tang, "DBP: Distributed Power Budgeting for Many-Core Systems in Dark Silicon", IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2022. (CCF A类期刊) (下载)
3. H. Wang, W. Li*, W. Qi*, D. Tang*, L. Huang, and H. Tang, "Runtime Performance Optimization of 3-D Microprocessors in Dark Silicon", IEEE Transactions on Computers (TC), 2021. (CCF A类期刊) (下载)
4. H. Wang, L. Hu*, X. Guo*, Y. Nie, and H. Tang, "Compact Piecewise Linear Model Based Temperature Control of Multi-Core Systems Considering Leakage Power", IEEE Transactions on Industrial Informatics (TII), 2020. (中科院一区top期刊,影响因子10.2) (下载)
5. H. Wang, T. Xiao*, D. Huang*, L. Zhang*, C. Zhang, H. Tang, and Y. Yuan, "Runtime Stress Estimation for Three-dimensional IC Reliability Management Using Artificial Neural Network", ACM Transactions on Design Automation of Electronic Systems (TODAES), 2019. (CCF B类期刊) (下载)
6. H. Wang, X. Guo*, S. Tan, C. Zhang, H. Tang, and Y. Yuan, "Leakage-Aware Predictive Thermal Management for Multi-Core Systems Using Echo State Network", IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2019. (CCF A类期刊) (下载)
7. H. Wang, D. Tang*, M. Zhang*, S. X.-D. Tan, C. Zhang, H. Tang, and Y. Yuan, "GDP: A greedy based dynamic power budgeting method for multi/many-core systems in dark silicon", IEEE Transactions on Computers (TC), 2019. (CCF A类期刊) (下载) (链接)
8. X. Guo*, H. Wang, C. Zhang, H. Tang, and Y Yuan, "Leakage-Aware Thermal Management for Multi-Core Systems Using Piecewise Linear Model Based Predictive Control", Asia and South Pacific Design Automation Conference (ASP-DAC), Jan. 2019, Tokyo, Japan. (CCF C类会议,最佳论文奖提名) (下载)
9. H. Wang, D. Huang*, R. Liu, C. Zhang, H. Tang, and Y. Yuan, "STREAM: Stress and thermal aware reliability management for 3-D ICs", IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2018. (CCF A类期刊) (下载) (链接)
10. H. Wang, J. Wan*, S. X.-D. Tan, C. Zhang, H. Tang, K. Huang, Z. Zhang, "A fast leakage-aware full-chip transient thermal estimation method", IEEE Transactions on Computers (TC), vol. 67, no.5, pp. 617-630, May 2018. (CCF A类期刊) (下载) (链接)
11. H. Wang, J. Ma*, S. X.-D. Tan, C. Zhang, H. Tang, K. Huang, Z. Zhang, "Hierarchical Dynamic Thermal Management Method for High-Performance Many-Core Microprocessors", ACM Transactions on Design Automation of Electronic Systems (TODAES), vol. 22, no.1, Artical 1, pp.1:1-1:21, July 2016. (CCF B类期刊) (下载) (链接)
12. L. Zhang*, H. Wang, S. X.-D. Tan, "Fast Stress Analysis for Runtime Reliability Enhancement of 3D IC Using Artificial Neural Network", Proc. International Symposium on Quality Electronic Design (ISQED), San Jose, CA, Mar. 2016. (下载) (链接)
13. H. Wang, M. Zhang*, S. X.-D. Tan, C. Zhang, Y. Yuan, K. Huang, Z. Zhang, "New Power Budgeting and Thermal Management Scheme for Multi-Core Systems in Dark Silicon", Proc. IEEE Internation System-on-Chip Conference (SOCC), Seattle, WA, Sep. 2016. (下载)
14. W. Liu*, H. Wang, et al., "Thermal modeling for energy-efficient smart building with advanced overfitting technique", Asia and South Pacific Design Automation Conference (ASP-DAC), Jan. 2016, Macao, China. (CCF C类会议) (下载)
15. J. Ma*, H. Wang, S. X.-D. Tan, C. Zhang, H. Tang, "Hybrid Dynamic Thermal Management Method with Model Predictive Control", Proc. Asia Pacific Conference on Circuits and Systems (APCCAS), Okinawa, Japan, Nov. 2014. (获学生会议奖金) (下载) (链接)
16. H. Wang, S. X.-D. Tan, D. Li, A. Gupta, and Y. Yuan, "Composable Thermal Modeling and Simulation for Architecture-Level Thermal Designs of Multi-core Microprocessors", ACM Transactions on Design Automation of Electronic Systems (TODAES), vol. 18, no. 2, pp. 28:1-28:27, March, 2013. (CCF B类期刊) (下载) (链接)
2007.9 -- 2008.11
美国加州大学
电子工程
硕士研究生毕业
理学硕士学位
2003.9 -- 2007.6
华中科技大学
电子信息工程
大学本科毕业
工学学士学位
2007.9 -- 2012.4
美国加州大学
电子工程
博士研究生毕业
哲学博士学位
2017.12 -- 至今
电子科技大学电子科学与技术学院(示范性微电子学院) 教师
2012.5 -- 2017.11
电子科技大学微电子与固体电子学院 教师
2008.11 -- 2009.3
美国加州大学 教学助理
2008.8 -- 2012.3
美国加州大学 研究助理
人工智能(AI)辅助芯片设计、芯片设计自动化(EDA)、以及计算机设计与优化(Computer Design)
邮箱 : wanghai@uestc.edu.cn