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Hai Wang received the BS degree from Huazhong University of Science and Technology, China, and the MS and PhD degrees from University of California, Riverside, in 2007, 2008, and 2012, respectively. He is currently an associate professor with the University of Electronic Science and Technology of China. 

His research interests include modeling, optimization, and artificial intelligence assisted design automation of VLSI circuits and systems. Now, he is focusing on AI assisted design automation and optimization of integrated circuits and systems, especially dark silicon integrated circuits and 3D integrated circuits. He is the principle investigator of many research projects, including the projects from national natural science fundation of China (NSFC) and from industrial companies like Huawei. 

He has published over 60 papers on top international journals and conferences. Recently, as the first author, he published 6 top ranked (CCF A rank or JCR 1st rank) journal papers (3 papers from IEEE Transactions on Computers (TC), 2 papers from IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), and 1 paper from IEEE Transactions on Industrial Informatics), 6 CCF B rank papers (from ACM Transactions on Design Automation of Electronic Systems (TODAES), DATE, ICCAD, etc.), and numerous CCF C rank papers. His recent work was nominated for best paper award at Asia and South Pacific Design Automation Conference (ASP-DAC) 2019 at Tokyo, Japan. 

He has served as technical program committee member of several international conferences including DATE, ASP-DAC and ISQED, and also served as reviewer of many journals including IEEE Transactions on Computers, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, and ACM Transactions on Design Automation of Electronic Systems. He received one Best Paper Award nomination from ASP-DAC in 2019.

Recent selected publications (authors in bold are myshelf or my students, authors with star marker * are my students):

1. H. Wang, X. Guo*, S. Tan, C. Zhang, H. Tang, and Y. Yuan, "Leakage-Aware Predictive Thermal Management for Multi-Core Systems Using Echo State Network", IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2019. (CCF A journal)(pdf)

2. H. Wang, D. Tang*, M. Zhang*, S. X.-D. Tan, C. Zhang, H. Tang, and Y. Yuan, "GDP: A greedy based dynamic power budgeting method for multi/many-core systems in dark silicon", IEEE Transactions on Computers (TC), 2018. (CCF A journal) (pdf) (link)

3. Xingxing Guo*, H. Wang, C. Zhang, H. Tang, and Y Yuan, "Leakage-Aware Thermal Management for Multi-Core Systems Using Piecewise Linear Model Based Predictive Control", Asia and South Pacific Design Automation Conference (ASP-DAC), Jan. 2019, Tokyo, Japan. (CCF C conference, best paper nomination) (pdf)

4. H. Wang, D. Huang*, R. Liu, C. Zhang, H. Tang, and Y. Yuan, "STREAM: Stress and thermal aware reliability management for 3D-ICs", IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2018. (CCF A journal) (pdf) (link)

5. H. Wang, J. Wan*, S. X.-D. Tan, C. Zhang, H. Tang, K. Huang, Z. Zhang, "A fast leakage-aware full-chip transient thermal estimation method", IEEE Transactions on Computers (TC), vol. 67, no.5, pp. 617-630, May 2018. (CCF A journal) (pdf) (link)

6. H. Wang, J. Ma*, S. X.-D. Tan, C. Zhang, H. Tang, K. Huang, Z. Zhang, "Hierarchical Dynamic Thermal Management Method for High-Performance Many-Core Microprocessors", ACM Transactions on Design Automation of Electronic Systems (TODAES), vol. 22, no.1, Artical 1, pp.1:1-1:21, July 2016. (CCF B journal) (pdf) (link)

7. L. Zhang*, H. Wang, S. X.-D. Tan, "Fast Stress Analysis for Runtime Reliability Enhancement of 3D IC Using Artificial Neural Network", Proc. International Symposium on Quality Electronic Design (ISQED), San Jose, CA, Mar. 2016. (pdf) (link)

8. H. Wang, M. Zhang*, S. X.-D. Tan, C. Zhang, Y. Yuan, K. Huang, Z. Zhang, "New Power Budgeting and Thermal Management Scheme for Multi-Core Systems in Dark Silicon", Proc. IEEE Internation System-on-Chip Conference (SOCC), Seattle, WA, Sep. 2016. (pdf)

9. W. Liu*, H. Wang, et al., "Thermal modeling for energy-efficient smart building with advanced overfitting technique", Asia and South Pacific Design Automation Conference (ASP-DAC), Jan. 2016, Macao, China. (CCF C conference) (pdf)

10. J. Ma*, H. Wang, S. X.-D. Tan, C. Zhang, H. Tang, "Hybrid Dynamic Thermal Management Method with Model Predictive Control", Proc. Asia Pacific Conference on Circuits and Systems (APCCAS), Okinawa, Japan, Nov. 2014. (student travel award) (pdf) (link) 

11. H. Wang, S. X.-D. Tan, D. Li, A. Gupta, and Y. Yuan, "Composable Thermal Modeling and Simulation for Architecture-Level Thermal Designs of Multi-core Microprocessors", ACM Transactions on Design Automation of Electronic Systems (TODAES), vol. 18, no. 2, pp. 28:1-28:27, March, 2013. （CCF B journal） (pdf) (link)