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  • 电子邮箱:hmhuang@uestc.edu.cn
  • 入职时间:2013-07-05
  • 所在单位:集成电路科学与工程学院(示范性微电子学院)
  • 学历:博士研究生毕业
  • 性别:
  • 学位:工学博士学位
  • 职称:副教授
  • 在职信息:在职人员
  • 毕业院校:电子科技大学
  • 硕士生导师
科学研究
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  • 论文成果

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  • 研究领域

    • 主要研究新型功率器件和功率集成电路,包括超级结(superjunction)器件、IGBT、MCT、LDMOS等


      学术成果

      • H. Huang, J. Cheng, B. Yi, W. Zhang, and W. T. Ng, “A unified model of vertical doped and polarized superjunction GaN devices.” Applied Physics Letters, vol. 116, 102103, Mar. 2020. (入选编辑精选Editor’s Pick).

      • H. Huang, Y. Xu, H. Li, Z. Zhang, Y. Li, H. Zhang, J. Cheng, B. Yi, Z. Wang, G. Zhang, “Optimization and comparison of specific on-resistance for superjunction MOSFETs considering three-dimensional and insulator-pillar concepts,” IEEE Trans. Electron Devices, vol. 69, no. 3, pp. 1162-1168, March 2022, doi: 10.1109/TED.2021.3130105.

      • H. Huang, K. Hu, W. Xu, S. Xu, W. Cui, W. Zhang, and W. T. Ng, “Numerical solutions for electric field lines and breakdown voltages in superjunction-like power devices,” IEEE Trans. Electron Devices, vol. 67, no. 9, 3898-3902, Sep. 2020.

      • H. Huang, S. Xu, W. Xu, K. Hu, J. Cheng, H. Hu, and B. Yi, “Optimization and comparison of drift region specific on-resistance for vertical power Hk MOSFETs and SJ MOSFETs with identical aspect ratio.” IEEE Trans. Electron Devices, vol. 67, no. 6, pp. 2463-2470, Jun. 2020.

      • H. Huang and X. Chen, “Optimization of specific on-resistance of semisuperjunction trench MOSFETs with charge balance,” IEEE Trans. electron devices, vol. 60, no. 3, pp. 1195–1201, 2013.

      • H. Huang and X. Chen, “Optimization of specific on-resistance of balanced symmetric superjunction MOSFETs based on a better approximation of ionization integral,” IEEE Trans. Electron Devices, vol. 59, no. 10, pp. 2742–2747, 2012

      • J. Xiong, H. Huang, W. Zhen, Z. Zhang, J. Cheng, B. Yi, H. Yang, G. Zhang, “A Rigorous Analysis of Specific ON-resistance for 4H-SiC Superjunction Devices,” ICSICT 2022, accepted.

      • X. Tong, H. Pei, W. Zhen, H. Huang, Z. Zhang, J. Cheng, B. Yi, and H. Yang, “A Novel Insulating-Pillar Superjunction with Vertical Insulators: Breakthrough of Specific ON-Resistance Limit,” ICSICT 2022, accepted.

      • J. Zhang, Y. Jiang, H. Huang, Z. Zhang, J. Cheng, B. Yi, H. Yang, and Z. Wang, “Superjunction SiC TCOX-MOSFET: Study and Comparison,” ICSICT 2022, accepted.

      • WenjunLi, Haimeng Huang, Zimin Zhang, Junji Cheng, Bo Yi, Hongqiang Yang, and Zhiming Wang, “Optimization of Specific ON-Resistance of Superjunction Device with Two-Zones Variation Vertical Doping Profile”, ICSICT 2022, accepted.

      • J. Huang, H. Huang*, and X. Chen, “Simulation study of a low on-state voltage superjunction IGBT with self-biased PMOS,” IEEE Trans. Electron Devices, vol. 66, no. 7, pp. 3242–3246, 2019.

      • J. Huang, H. Huang*, and X. Chen, “Simulation study of a low on-state voltage and saturation current TCIGBT with diodes,” IEEE Trans. Electron Devices, vol. 66, no. 3, pp. 1617–1620, 2019.

      • J. Huang, H. Huang*, X. Lyu, and X. B. Chen, “Simulation study of a low switching loss FD-IGBT with high di/dt and dv/dt controllability,” IEEE Trans. Electron Devices, vol. 65, no. 12, pp. 5545–5548, 2018.

      • J. Cheng, H. Huang, B. Yi, W. Zhang, and W. T. Ng, “A TCAD study on lateral power MOSFET with dual conduction paths and high-k passivation.” IEEE Electron Devices Letters, vol. 41, no. 2, pp. 260–263, 2020.

      • B. Yi, H. Hu, J. Lin, J. Cheng, H. Huang, and M. Kong, “SiC trench MOSFET with integrated side-wall Schottky barrier diode having p+ electric field shield,” IEICE Electronics Express, pp. 16–20 181 135, 2019.

      • W. Chen, J. Cheng, H. Huang, B. Zhang, and X. B. Chen, “The oppositely doped islands IGBT achieving ultralow turnoff loss,” IEEE Trans. Electron Devices, vol. 66, no. 8, pp. 3690–3693, 2019.

      • J. Lin, J. Cheng, P. Li, W. Chen, and H. Huang, “Study on SrTiO3 film for the application of power devices,” Superlattices and Microstructures, vol. 130, pp. 168–174, 2019.

      • J. Cheng, W. Chen, J. Lin, P. Li, B. Yi, H. Huang, and X. B. Chen, “Potential of utilizing high-k film to improve the cost performance of trench LDMOS,” IEEE Trans. Electron Devices, vol. 66, no. 7, pp. 3049–3054, 2019.

      • J. Wu, H. Huang, B. Yi, H. Hu, H. Hu, and X. B. Chen, “A snapback-free and low turn-off loss reverse-conducting SOI-LIGBT with embedded diode and MOSFET,” IEEE Journal of the Electron Devices Society, vol. 7, pp. 1013–1017, 2019.

      • B. Yi, M. Kong, J. Lin, J. Cheng, H. Huang, and X. Chen, “A 600-V super-junction pLDMOS utilizing electron current to enhance current capability,” IEEE Trans. Electron Devices, vol. 66, no. 5, pp. 2314–2320, 2019.

      • H. Hu, H. Huang, and X. B. Chen, “A novel double-RESURF SOI lateral TIGBT with self-biased nMOS for improved VCE-Eoff tradeoff relationship,” IEEE Trans. Electron Devices, vol. 66, no. 1, pp. 814–820, 2019.

      • H. Li, H. Huang, and X. Chen, “An improved SOI trench LDMOS with double vertical high-k insulator pillars,” Journal of Semiconductors, vol. 39, no. 9, p. 094009, 2018.

      • S. Guo, H. Huang, and X. B. Chen, “Study of the SOI-LDMOS with low conduction loss and less gate charge,” IEEE Trans. Electron Devices, vol. 65, no. 4, pp. 1645–1649, 2018.

      • P. Li, H. Huang, and X. Chen, “A low on-state voltage TIGBT with planar gate self-biased pMOS,” in 2017 IEEE 12th International Conference on Power Electronics and Drive Systems (PEDS). IEEE, 2017, pp. 456–459.

      • L. Liang, H. Huang, and X. Chen, “A variation lateral doping layer and lightly doped region compensated superjunction LDMOS,” in 2016 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC). IEEE, 2016, pp. 120–123.

      • Z. Lin, H. Huang, and X. Chen, “An improved superjunction structure with variation vertical doping profile,” IEEE Trans. Electron Devices, vol. 62, no. 1, pp. 228–231, 2014.

      • H. Huang and X. Chen, “New expressions for non-punch-through and punch-through abrupt parallel-plane junctions based on Chynoweth law,” Journal of Semiconductors, vol. 34, no. 7, p. 074003, 2013.

      • H. Huang and X. Chen, “An analytical model of the electric field distributions of buried superjunction devices,” Journal of Semiconductors, vol. 34, no. 6, p. 064006, 2013.

      • H. Huang, Y. Wang, and X. Chen, “An analytical model for SOI triple RESURF devices,” in 2011 9th IEEE International Conference on ASIC. IEEE, 2011, pp. 547–550