论文名称为“D-band wideband air-filled plate array antenna with multistage impedance matching based on MEMS micromachining technology”。该文报道了一种基于多级匹配策略的D波段宽带高效高增益平面阵列天线。该工作基于MEMS体硅微加工工艺，实现了D波段硅微波导传输线。在此基础上，采用窄边加载的方法拓展了并馈式等幅同相输出的功分网络的宽带。进一步，采用了由宽带高增益阶梯集成喇叭单元、阶梯加载的宽带功分腔体以及加载微扰结构的E面弯角垂直过渡结构构成的三级匹配方法，突破了亚毫米波频段大规模阵列天线带宽限制，设计了宽带D波段2×2子阵。MEMS微加工工艺可满足D波段加工精确高的要求，并具备与后端电路一体化封装集成的优势。工作主要完成人姚仕森、程钰间、吴亚飞、樊勇。

论文链接：https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=9047158

Abstract— A wideband air-filled plate array antenna with multistage impedance matching operated in D-band is proposed in this article. To achieve the wide bandwidth, three stages of impedance matching are introduced in the 2 × 2 subarray, including the step-profiled horn element, the step-profiled power divider cavity with two resonant points, and a modified E-plane bend transition. The integrated step-profiled horn with simple configuration can realize broadband matching. Wideband T-junctions are combined together to form a corporate feeding network. Essential matching pins are introduced to break through the upper bandwidth restriction of the feeding network. In addition, the square aperture shape of the horn element and the air-filled feeding structure contribute to the high radiation efficiency of the proposed array. To satisfy the fabrication tolerance, the MEMS micromachining technology with a high etching precision is utilized. The experimental results show a wide 1 dB down gain bandwidth of 23.54%. The maximum gain is 33.24 dBi and the peak efficiency is 70.91%.

Index Terms— D-band wideband array antenna, integrated step-profiled horn, MEMS micromachining technology, multistage impedance matching.