D. Wang, C. J. Li, Y. Fan, and Y. J. Cheng, “A W-band low-loss planar MMICs to RWG transition using copper additive manufacturing and its 1-D phased array antenna-in-package application,” IEEE Trans. Microw. Theory Techn., vol. 73, no. 6, pp. 3064-3074, Jun. 2025.
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