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surface in-situ activation for electroless deposition of robust conductive copper patterns on polyimide film
Affiliation of Author(s):材料与能源学院
Teaching and Research Group:化学系
Journal:Journal of the Taiwan Institute of Chemical Engineers
Place of Publication:台湾
Abstract:SCI
Indexed by:Applied Research
Discipline:Engineering
First-Level Discipline:Materials science and engineering
Volume:97 (2019)
Translation or Not:no
Date of Publication:2019-04-01