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Enhancing adhesion performance of sputtering Ti/Cu film on pretreated composite prepreg for stacking structure of IC substrates
Affiliation of Author(s):材料与能源学院
Teaching and Research Group:化学系
Journal:Composites Part B: Engineering,
Place of Publication:国外
Abstract:SCI
Indexed by:Development research
Discipline:Engineering
First-Level Discipline:Integrated Circuit Engineering
Volume:2019, 158
Translation or Not:no
Date of Publication:2019-01-10