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A comparison of typical additives for copper electroplating based on theoretical computation
Affiliation of Author(s):材料与能源学院
Teaching and Research Group:化学系
Journal:Computational Materials Science,
Place of Publication:国外
Abstract:SCI
Indexed by:Unit Twenty Basic Research
Discipline:Engineering
First-Level Discipline:Chemical engineering and technology
Volume:2018, 147
Translation or Not:no
Date of Publication:2018-01-15