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Enhancing adhesion performance of no-flow prepreg to form multilayer structure of printed circuit boards with plasma-induced surface modification
Affiliation of Author(s):材料与能源学院
Teaching and Research Group:化学系
Journal:Surface and Coatings Technology,
Place of Publication:国外
Abstract:SCI
Indexed by:Applied Research
Discipline:Engineering
First-Level Discipline:Electronic science and technology
Volume:2018, 333
Translation or Not:no
Date of Publication:2018-01-31