Jun Hu was born in Quzhou, Zhejiang, China, in October 1973. He received the B.S., M.S. and Ph.D. degrees in electromagnetic field and microwave technology from the University of Electronic Science and Technology of China (UESTC), Chengdu, China, in 1995, 1998 and 2000, respectively. He joined UESTC as a Lecturer in December 1999, and was promoted as an Associate Professor and Full Professor in 2002 and 2008, respectively. In 2001, he was a Visiting Scholar of Research Assistant at the Wireless Communication Research Centre, City University of Hong Kong. In 2010, he was a Visiting Scholar with the Electro Science Laboratory, Department of Electrical and Computer Engineering, Ohio State University, Columbus, OH, USA. He was a Visiting Professor with the City University of Hong Kong in 2011.

His research interests include fast numerical methods in computational electromagnetics and electromagnetic scattering and radiation, as well as the integration of artificial intelligence and electromagnetic algorithms. He has firstly developed the Multi-layer Fast Multipole Algorithm (MLFMA) in China and has further developed into an EM industrial software AUEST, which has been widely used in many key engineering applications. He has authored or co-authored over 200 SCI indexed papers in journals such as IEEE T-AP, IEEE T-EMC, and PIEEE, and he was a corecipient of the 2018 IEEE AP-S Sergei A. Schelkunoff Transactions Prize Paper Award. He won a China National Technology Invention Award in the year 2023 and a few other key Awards, which were in recognition of his contribution to the domestic EM industrial software development and the innovative studies on the integration of EM radiation & scattering. He has delivered over 20 Keynoted Speeches at major academic conferences of the field, and has served as the General Chair/Co-Chair of those conferences over 10 times. He served as the Chairperson for the Student Activities Committee in the IEEE Chengdu Section from 2010 to2016 and the IEEE Chengdu AP/EMC Joint Chapter from 2014 to 2016. Currently, he serves as a member of the Selection Committee of the IEEE APS Distinguished Lecturer and a member of the URSI China Electromagnetic Field Special Committee. He is also a fellow of the Chinese Institute of Electronics (CIE), Chair of the International Cooperation Committee of the CIE, and the Vice Chair of the Radio Wave Propagation Branch of CIE.

Selected Publications:

[1]     X. Xue, Jun Hu, et al, “Solving numerical Green’s function of 3-D randomly distributed dielectric targets using Kolmogorov–Arnold networks,” IEEE Trans. Antennas Propagat. vol. 74, no. 1, pp. 622-635, Jan. 2026.

[2]     H. Cao，L. Lei，Y. Lu，R. Zhao，and Jun Hu, “Curvilinear nonconformal adaptive h-refinement using augmented EFIE with a multiresolution preconditioner for analyzing complex objects,” IEEE Trans. Antennas Propagat., vol. 72, no. 7, pp. 5910-5922, July 2024. (Featured Article)

[3]     X. Yang，M. Jiang，L. Shen，P.H. Jia，Z. Rong，Y. Chen，L. Lei，and Jun Hu, “A flexible FEM-BEM-DDM for EM scattering by multiscale anisotropic objects,” IEEE Trans. Antennas Propagat., vol. 69, no. 12, pp. 8562-8573, Dec. 2021.

[4]     Z. Rong, M. Jiang, Y. Chen, L. Lei, X. Yang, and Jun Hu, “Strong admissibility skeletonization factorization for fast direct solution of electromagnetic scattering from conducting objects,” IEEE Trans. Antennas Propagat., vol. 69, no. 10, pp. 6607-6617, Oct. 2021.

[5]     Z. Rong, M. Jiang, Y. Chen, L. Lei, Z. Nie, and Jun Hu, “Fast direct surface integral equation solution for electromagnetic scattering analysis with skeletonization factorization,” IEEE Trans. Antennas Propagat., vol. 68, no. 4, pp. 3016-3025, Apr. 2020.

[6]     M. Jiang, Z. Rong, L. Lei, X. Li, Y. Chen, S. Sun, Z. Nie, and Jun Hu, “SIE-DDM based on a hybrid direct–iterative approach for analysis of multiscale problems,” IEEE Trans. Antennas Propagat., vol. 67, no. 12, pp. 7440-7451, Dec. 2019.

[7]     P.-H. Jia, L. Lei, Jun Hu, et al, “Twofold domain decomposition method for the analysis of multiscale composite structures,” IEEE Trans. Antennas Propagat., vol. 67, no. 9, pp. 6090-6103, Sep. 2019.

[8]     Z. Rong, M. Jiang, Y. Chen, L. Lei, X. Li, Z. Nie, and Jun Hu, “Fast direct solution of integral equations with modified HODLR structure for analyzing electromagnetic scattering problems,” IEEE Trans. Antennas Propagat., vol. 67, no. 5, pp. 3288-3296, May 2019.

[9]     X. Li，L. Lei， H. Zhao，L. Guo，M. Jiang，Q. Cai，Z. Nie，and Jun Hu, “Efficient solution of scattering from composite planar thin dielectric-conductor objects by volume-surface integral equation and simplified prism vector basis functions,” IEEE Trans. Antennas Propagat., vol. 66, no. 5, pp. 2686-2690, May 2018.

[10]  H. Guo, Y. Liu, Jun Hu, and E. Michielssen, “A butterfly-based direct integral-equation solver using hierarchical LU factorization for analyzing scattering from electrically large conducting objects,” IEEE Trans. Antennas Propagat., vol. 65, no. 9, pp. 4742-4750, Sept. 2017. (IEEE APS S. A. Schelkunoff Transactions Prize Paper Award in 2018)

[11]  Jun Hu, R. Zhao, et al, “Domain decomposition method based on integral equation for solution of scattering from very thin, conducting cavity,” IEEE Trans. Antennas Propagat., vol. 62, no. 10, pp. 5344-5348, Oct. 2014.

[12]  Jun Hu, Y. Li, Z. Nie, and H. Zhao, “Modal characteristic basis function method for solving scattering from multiple conducting bodies of revolution,” IEEE Trans. Antennas Propagat., vol. 62, no. 2, pp. 870-877, Feb. 2014.

[13]  H. Shao, Jun Hu, et al, “Analyzing large-scale arrays using tangential equivalence principle algorithm with characteristic basis functions,” Proc. IEEE, vol. 101, no. 2, pp. 414-422, Feb. 2013.

[14]  Jun Hu，W. Lu，et al, “Electromagnetic analysis of large scale periodic arrays using a two-level CBFs method accelerated with FMM-FFT,” IEEE Trans. Antennas Propagat., vol. 60, no. 12, pp. 5709-5716, Dec. 2012.

       [15]     Jun. Hu，Z. Nie，et al, “Fast solution of scattering from conducting structures by local MLFMA based on improved electric field integral equation,” IEEE Trans. Electromag. Compat., vol. 50, no. 4, pp. 940-945, Apr. 2008.