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备注：China Economic Review, 2009, 20: 91-102.
全部作者： Yong Zeng, Bo Liu,Woon K. Wong
是否译文：否
上一条：Yongqi Fu, Ngoi Kok Ann Bryan, Influence of redeposition effect for focused ion beam three-dimensional micromachining. International Journal of Advanced Manufacturing Technology. Vol.16. No.12, pp. 877~880 (2000).
下一条：Yongqi Fu, Ngoi Kok Ann Bryan, Ong Nan Shing, Investigation of submicron linewidth direct deposition for high-density IC chip modification by focused ion beam. International Journal of Advanced Manufacturing Technology. Vol.17. No.11, pp. 835-839 (2001).
