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Interfacial Stress Prediction of Tri-layer Packaging with Void in Adhesive

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Journal:2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)

All the Authors:LiLi Chen,Xiaoping He,Liushan Lai,Bei Peng,Peng Peng

First Author:Wu Zhou

Document Code:12-15 May 2019

Document Type:C

Page Number:Paris, France, France

ISSN No.:978-1-7281-3286-0

Translation or Not:no

Date of Publication:2019-05-12

Date of Publication:2019-05-12

Pre One:Improved MEMS piezoelectric vibratory stage with reduced off-axis error

Next One:Analytical study of temperature coefficients of bulk MEMS capacitiveaccelerometers operating in closed-loop mode

周吴

Gender:Male Education Level:With Certificate of Graduation for Doctorate Study Alma Mater:Southwest Jiaotong University Degree:Doctor of Engineering Status:On the job School/Department:University of Electronic Science and Technology of China E-Mail:

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