论文名称：A W-Band Low-Loss Planar MMICs to RWG Transition Using Copper Additive Manufacturing and Its 1-D Phased Array Antenna-in-Package Application。本文提出一种面向W波段一维扫描相控阵系统的新型集成方案，重点研究高效转换结构与天线集成技术。该方案采用铜增材制造工艺，所设计的转换结构具有低损耗与小尺寸特性，可实现脊波导缝隙天线与射频单片微波集成电路的无缝集成。该W波段转换结构在85-105 GHz频带内呈现宽阻抗带宽特性，反射系数低于-13 dB，插入损耗小于0.3 dB。在94 GHz工作频点，天线横向尺寸仅为0.45倍自由空间波长，支持±60°的一维扫描范围，显著提升了其在W波段一维相控阵应用中的适用性。转换结构尺寸仅为1.4×3.43 mm²，展现出在W波段射频前端集成领域的巨大潜力。

工作主要完成人：王鼎，李成佳，樊勇，程钰间。

论文链接：https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10716257

Abstract—This article introduces a novel integration approach for W-band 1-D scanning phased array systems, focusing on efficient transition structures and antenna integration. Utilizing copper additive manufacturing (AM) technology, the proposed transitions exhibit low loss and compact size, enabling the seamless integration of ridge waveguide (RWG) slot antennas with RF MMICs. The W-band transition offers a wide impedance bandwidth ranging from 85 to 105 GHz, with a reflection coefficient below −13 dB and an insertion loss (IL) of less than 0.3 dB. At 94 GHz, the transversal profile of the antenna is 0.45λ0, facilitating 1-D scanning up to ±60◦ and enhancing its suitability for W-band 1-D phased array applications. With a transition structure size of merely 1.4×3.43 mm², this approach demonstrates substantial potential for W-band RF front-end integration.

Index Terms—Antenna-in-package (AiP), copper additive manufacturing (AM), rectangular microcoaxial line (RµCL), RF packaging, W-band transition, wire-bond.