论文名称：A Low-Loss Scalable Fan-Out Wafer Level Packaging for W-Band Phased Array Transceiver。本文介绍了一款采用扇出型晶圆级封装技术的低成本紧凑型W波段4×4相控阵天线，适用于高性能应用场景。该封装尺寸为8.3×7.1 mm，集成了16通道收发芯片。为最大限度降低插入损耗并提升在W波段内的阻抗匹配性能，设计中采用了空气填充接地共面波导传输线结构。通过结合球栅阵列与PCB内嵌铜柱的创新热管理策略，确保了高效散热。实验结果表明：该阵列在H面可实现±40°扫描，E面可实现±30°扫描，在94 GHz频点处等效全向辐射功率达35 dBm。所提出的相控阵通过降低封装损耗、减少金属层数量并提升成本效益，相较于现有设计展现出更优性能，因此成为雷达与传感应用领域具有前景的解决方案。

工作主要完成人：王鼎，胡鸿斌，彭琦，夏晨辉，齐晓琳，樊勇，程钰间。

论文链接：https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11021223

Abstract—This article introduces a low-cost compact W-band 4 ×4 phased array antenna utilizing fan-out wafer-level pack age (FOWLP) for high-performance applications. The package, measuring 8.3 × 7.1 mm, integrates a 16-channel transceiver die. To minimize the insertion loss and enhance impedance matching across the W band, the design incorporates an air-filled grounded coplanar waveguide (AF-GCPW) transmission line. An innovative thermal management strategy, which includes ball grid arrays (BGAs) and embedded copper slugs in the PCB, ensures efficient heat dissipation. Experimental results reveal that the array can achieve scanning capabilities of ±40◦ in the H-plane and ±30◦ in the E-plane, with an effective isotropic radiated power (EIRP) of 35 dBm at 94 GHz. The proposed phased array demonstrates superior performance compared to existing designs by reducing packaging loss, minimizing the number of metal layers, and enhancing cost-effectiveness. Consequently, it emerges as a promising solution for radar and sensing applications.

Index Terms—Coplanar waveguide (CPW), fan-out wafer level package (FOWLP), integrated antenna, millimeter wave (mmWave), phased array, RF packaging, W band.