On-chip Terahertz Electronics: From Device-electromagnetic Integration to Energy-efficient, Large-scale Microsystems

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Affiliation of Author(s):Massachusetts Institute of Technology (MIT)

Journal:2016 IEEE International Electron Devices Meeting (IEDM)

Place of Publication:San Francisco, CA, USA

Abstract:This paper summarizes our approaches which synthesize the optimum electromagnetic (EM)-wave environment around various silicon devices, in order to maximize the device efficiency with minimum passive loss and footprint. This has enabled multi-mW THz radiation in standard silicon processes. Various critical capabilities for future THz microsystems, including integrated phase locking, multi-pixel coherent imaging, and an ultra-broadband inter-chip waveguide link, are also demonstrated.

All the Authors:J. W. Holloway,C. Jiang,A. Mostajeran,E. Afshari,A. Cathelin,Y. Zhang,K. K. O.,L. Boglione,T. M. Hancock,C. Wang,Z. Hu,G. Zhang

First Author:R. Han

Indexed by:Conference

Document Code:10.1109/IEDM.2016.7838507

Discipline:Engineering

First-Level Discipline:Electronic science and technology

Page Number:29.6.1-29.6.4

ISSN No.:2156-017X

Translation or Not:no

Date of Publication:2016-12-03

Date of Publication:2016-12-03