王海
213
开通时间 : ..
最后更新时间 : ..
发表刊物:IEEE Transactions on Very Large Scale Integration (VLSI) Systems, CCF B类期刊
卷号:24
期号:3
页面范围:1140-1150
是否译文:否
发表时间:2016-03-01
附件:
tvlsi_he2016.pdf 下载 : [] 次
上一条:- L. Zhang, H. Wang, et al., "Fast stress analysis for runtime reliability enhancement of 3D IC using artificial neural network"
下一条:- W. Liu, H. Wang, et al., "Thermal modeling for energy-efficient smart building with advanced overfitting mitigation technique"