Polymer-based materials are commonly used as an adhesion layer for bonding die chip and substrate in micro-system packaging. Their properties exhibit significant impact on the stability and reliability of micro-devices. The viscoelasticity, one of most important attributes of adhesive materials, is investigated for the first time in this paper to evaluate the long-term drift of micro-accelerometers. The accelerometer was modeled by a finite element (FE) method to emulate the structure deformation and stress development induced by change of adhesive property. Furthermore, the viscoelastic property of the adhesive was obtained by a series of stress–relaxation experiments using dynamic mechanical analysis (DMA). The DMA curve was imported into the FE model to predict the drift of micro-accelerometers over time and temperature. The prediction results verified by experiments showed that the accelerometer experienced output drift due to the development of packaging stress induced by both the thermal mismatch and viscoelastic behaviors of the adhesive. The accelerometers stored at room temperature displayed a continuous drift of zero offset and sensitivity because of the material viscoelasticity. Moreover, the drift level of accelerometers experiencing high temperature load was relatively higher than those of lower temperature in the same period.