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Investigation of the Thermal Drift of MEMS Capacitive Accelerometers Induced by the Overflow of Die Attachment Adhesive

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Journal:IEEE Transactions on Components, Packaging and Manufacturing Technology

All the Authors:Peng Peng,Wu Zhou,Huijun Yu,Hao Qu,Xiaoping He

Correspondence Author:Bei Peng

Volume:6

Issue:5

Translation or Not:no

Date of Publication:2016-05-10

Date of Publication:2016-05-10

Pre One:Dielectric charging induced drift in micro device reliability-a review

Next One:Analytical study and compensation for temperature drifts of a bulksilicon MEMS capacitive accelerometer

周吴

Gender:Male Education Level:With Certificate of Graduation for Doctorate Study Alma Mater:Southwest Jiaotong University Degree:Doctor of Engineering Status:On the job School/Department:University of Electronic Science and Technology of China E-Mail:

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