Adhesive attaching is a common method used in the packaging of high accurate MEMS devices. A full understanding of the effects of adhesive on device performance, therefore, plays a significant role in MEMS design because the thermal stress formed in packaging process highly depends on the shape, size, amount, properties and layout of the die attach adhesive. This paper investigates intensively the influence of adhesive nonuniformity in the sensitive direction of microaccelerometers on the distribution of thermal stress during the variation of environment temperature. The thermal stress will induce a movement of
anchors and lead to nonzero voltage output of microaccelerometer. The influence of the adhesive with different levels of nonuniformity k on zero voltage output is investigated and the results show that the adhesive nonuniformity significantly influences the zero offset of the sensors, and the maximum one can reach 8.6 mV when nonuniformity factor is 0.975.