Xun Luo

Personal Information

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Professor   Supervisor of Doctorate Candidates  

Academic Titles:Head of Center for Advanced Semiconductor and Integrated Micro-System

Honors and Titles:IEEE Outstanding Young Engineer Award

Personal Profile

Prof. Xun Luo was born in Sichuan, China. He received B.E. degree and Ph.D. degree (both with highest honors) in electronic engineering from University of Electronic Science and Technology of China (UESTC), Chengdu, China, in 2005 and 2011, respectively.

During the past 22 years, Prof. Luo guided a serises of industrial and academic R&D projects about 40M US$, and he has diverse experience in microelectronics and communication systems. From 2002 to 2005, he was with Chengdu Sine Science and Technology Ltd., where he led the 0.2-20 GHz front-end R&D project. From 2005 to 2006, he was with Shanghai Academy of Spaceflight Technology (SAST) for space communication R&D. In 2007, he was with Philips Research East-Asia, Shanghai, and involved in research of radio front-end for multi-mode/multi-card mobile systems. From 2010 to 2013, Prof. Luo was with the Huawei Technologies Co., Ltd., as the General Manager to guide the microwave/mm-wave mobile & backhaul R&D projects for LTE+ & 5G communication with successful commercial products. Before joining UESTC, he was Assistant Professor (Tenure Track) in Department of Microelectronics, Delft University of Technology (TUDelft). Since June 2015, he has joined UESTC as Full Professor & Executive Director in Center for Integrated Circuits (CIC), UESTC. Since March 2020, he founded and has been appointed as the Head of the Center for Advanced Semiconductor and Integrated Micro-System (ASIS), UESTC. He has published more than 160 journal and conference papers, and holds 57 granted patents. His research interests include the RF/microwave/mm-wave integrated circuits, multiple-resonance THz modules, reconfigurable passive circuits, smart antennas with sensor network, artificial-intelligence microsystems, multi-function backhaul/wireless application, and system in package.

Prof. Luo was selected by the IEEE MTT-Society as IEEE Outstanding Young Engineer Award in 2022 and IEEE Meritorious Service Award in 2022, and bestowed by China as the China Overseas Chinese Contribution Award in 2016. Under his leadership, the Center for ASIS was bestowed by UESTC as recipents of the UESTC Outstanding Team for Teaching and Education Award in 2021 and the UESTC Excellent Team for Postgraduate Supervision Award in 2021. He was selected as the 2021 UESTC Top Ten People of The Year. He also won the UESTC Distinguished Innovation and Teaching Award in 2018, and the UESTC Outstanding Undergraduate Teaching Promotion Award in 2016. He was recipients of the 2008 Huawei Scholarship, 2009 Intel Fellowship, 2009 Rohde & Schwarz Scholarship, and 2010 Mediatek Scholarship, respectively. During the period in Huawei, he was recipients of 2011 Huawei Transmission Network R&D Advanced Tech. Achievement Award (1st place), Huawei Distinguished Young Engineer Award in 2011 and 2012, and Huawei President Award in 2013, respectively. He was the recipient of 2013 Sichuan Province Outstanding Doctoral Dissertations Award, China. His research group Big-Data Electronics & Advanced Micro-Systems Lab (BEAM X-LAB) has won a number of best paper awards, design competition awards, and honorable international scholarships, including the IEEE RFIC Best Student Paper Award in 2021, IEEE IMS Sixty-Second Presentation Competition Award in 2019, IEEE IWS Best Student Paper Award in 2015 and 2018, IEEE RFIT Best Student Paper Award in 2016 and 2019, IEEE RFIT Best Student Design Competition Award in 2016, IEEE IMS Best Student Design Competition Award in 2017, 2018, 2019, and 2023, IEEE MTT-Society Undergraduate/Pre-Graduate Scholarship Award in 2017, 2020, 2021, 2022, and 2024, IEEE MTT-Society Graduate Fellowship Award in 2018, 2020, 2021, 2022, and 2023, IEEE SSC-Society Predoctoral Achievement Award in 2021, 2022, and 2023, and Chinese Institute of Electronics Outstanding Scholarship Award in 2020 and 2021.

Prof. Luo is an IEEE Senior Member since 2012. He serves on the Technical Program Committees of IEEE International Solid-State Circuits Conference (ISSCC), IEEE International Microwave Symposium (IMS), IEEE Radio Frequency Integrated Circuits Symposium (RFIC), IEEE Custom Integrated Circuits Conference (CICC), IEEE International Wireless Symposium (IWS), etc. He is also the IEEE MTT-Society Technical Committee Member of MTT-TC-4 on Microwave Passive Components and Transmission Line Structures, MTT-TC-5 on Filters, and MTT-TC-23 on Wireless Communications. He serves as Associate Editor or Guest Editor of IEEE Mircowave Magazine, IEEE Open Journal of Solid-State Circuits Society, and IET Microwaves, Antennas & Propagation. He was Track Editor of IEEE Microwave and Wireless Components Letters from 2018 to 2021. 

Educational Experience

2001.9 2005.7

  • UESTC
  • Electronics and Information
  • Bachelor of Engineering
  • With Certificate of Graduation for Undergraduate Study

2006.9 2011.6

  • UESTC
  • Circuits and Systems
  • Doctor of Engineering
  • With Certificate of Graduation for Doctorate Study

Work ExperienceMore>>

2015.6 Now
  • University of Electronic Science and Technology of China
  • Full Professor
2014.11 2015.8
  • Delft University of Technology
  • Assistant Professor
2013.7 2014.10
  • Delft University of Technology
  • Postdoctoral Researcher
2010.10 2013.6
  • Huawei Technologies Co., Ltd.
  • Project Manager
2005.8 2006.3
  • Shanghai Academy of Spaceflight Technology
  • R&D Engineer

Social AffiliationsMore>>

  • Track Editor, IEEE Microwave and Wireless Components Letters

  • Guest Editor, IEEE Microwave Magazine

  • Associate Editor, IEEE Open Journal of Solid-State Circuits Society

  • MTT-TC-4 (Microwave Passive Components and Transmission Line Structures) Member, IEEE Microwave Theory and Techniques Society

  • MTT-TC-5 (Filters) Member, IEEE Microwave Theory and Techniques Society

  • MTT-TC-23 (Wireless Communications) Member, IEEE Microwave Theory and Techniques Society

  • Vice Chair, IEEE MTT-Society Chengdu Chapter

  • TPC Member, IEEE International Solid-State Circuits Conference

  • TPC Member, IEEE International Microwave Symposium

  • TPC Member, IEEE Radio Frequency Integrated Circuits Symposium

  • TPC Member, IEEE Custom Integrated Circuits Conference

  • Reviewer Committee Member, European Microwave Week

  • Associate Editor, IET Microwaves, Antennas & Propagation

  • Subject Chair, IEEE International Microwave Symposium Student Design Competition

  • TPC Co-Chair, 2023 IEEE International Wireless Symposium

  • TPC Co-Chair, 2019 IEEE International Symposium on RFIT

  • TPC Co-Chair, 2018 IEEE International Wireless Symposium

Research FocusMore>>

  • Big-Data Electronics & Artificial-Intelligence Micro-Systems
  • Digitally-Assisted RF/Microwave/MM-Wave Integrated Circuits
  • On-Chip THz Communication